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Creating Footprints - Laser Munich Highlight

2019 – Creating Footprints

We engineered an advanced housing setting a new industrial standard for integrated beam shaping and high power operation. The extremely small form factor still proves a superior heat dissipation. Being hermetically sealed it meets critical reliability requirements of any harsh target application. We solved all the engineering challenges for you. Just mount it on your PCB. Get the future started at 808nm with 20W (pulsed operation) multimode power or at 1060nm with 650mW (cw) single mode power.

Referring Datasheets:

RWL_1060_FLW

BAL_808_FLW